• DocumentCode
    2659609
  • Title

    Degradation properties of the epoxy nanocomposite caused by a gamma-ray irradiation

  • Author

    Kim, K.Y. ; Im, D.S. ; Choi, J.H. ; Lee, K.Y.

  • Author_Institution
    Adv. Radiat. Technol. Inst., Korea Atomic Energy Res. Inst., Jeongup, South Korea
  • fYear
    2010
  • fDate
    17-20 Oct. 2010
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper describes the degradation properties of bisphenol A type epoxy with a carboxyl-terminated butadiene-acrylonitrile (CTBN) and nano-clay. For evaluation of degradation by radiation, gamma rays of 500 kGy, 1000 kGy, and 1500 kGy were used to irradiate the samples at the dose rate of 8 kGy/hr. The degradation properties of the gamma-ray irradiated samples were measured using a thermogravimetric analyzer (TGA). In the TGA experiment, as the absorption dose increased and the heating rate decreased, the thermogravimetry-derivative thermo gravimetry (TG-DTG) curves of the samples rapidly decreased. As the absorption dose increased, the activation energy of the epoxy decreased sharply, but that of the samples to which clay had been added tended to decrease initially and then increase at 1500 kGy.
  • Keywords
    clay; gamma-ray effects; heat treatment; nanocomposites; resins; thermal analysis; TGA; absorption dose; activation energy; bisphenol A type epoxy; carboxyl-terminated butadieneacrylonitrile; degradation properties; epoxy nanocomposite; gamma-ray irradiation; heating rate; nanoclay; radiation absorbed dose 1000 kGy; radiation absorbed dose 1500 kGy; radiation absorbed dose 500 kGy; thermogravimetric analysis; thermogravimetry-derivative thermogravimetry curves; Absorption; Degradation; Gamma rays; Heating; Radiation effects; Rubber; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2010 Annual Report Conference on
  • Conference_Location
    West Lafayette, IN
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4244-9468-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2010.5724022
  • Filename
    5724022