Title :
Technologies for rapid prototyping of multi-chip modules
Author :
Miracky, R. ; Bishop, T. ; Galanakis, C. ; Hashemi, H. ; Hirsch, T. ; Madere, S. ; Muller, H. ; Rudwick, T. ; Smith, L. ; Sommerfeldt, S. ; Weigler, B.
Author_Institution :
Microelectron., & Comput. Technol. Corp., Austin, TX, USA
Abstract :
Component technologies are described to be used in the maskless customization of multi-chip modules (MCMs) including: laser processes for linking and cutting conductors; an interconnect net routing tool; and MCM assembly, test, and electrical characterization methods. Each component technology was successfully demonstrated through independent tests. The first integrated demonstration of these technologies is the customization of a three-chip MCM centered around a Motorola 88100-based chip set
Keywords :
VLSI; circuit layout CAD; integrated circuit technology; modules; MCM assembly; Motorola 88100-based chip set; interconnect net routing tool; laser processes; maskless customization; multi-chip modules; rapid prototyping; Chemical lasers; Conductors; Copper; Joining processes; Laser beam cutting; Polyimides; Prototypes; Substrates; Testing; Wiring;
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1991. ICCD '91. Proceedings, 1991 IEEE International Conference on
Conference_Location :
Cambridge, MA
Print_ISBN :
0-8186-2270-9
DOI :
10.1109/ICCD.1991.139980
