DocumentCode :
2659634
Title :
Effect of nano-fillers on electrical breakdown behavior of epoxy resin
Author :
Wang, Qi ; Curtis, Peter ; Chen, George
Author_Institution :
Sch. of Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
fYear :
2010
fDate :
17-20 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
Epoxy resin is widely used in high voltage apparatus as insulation due to its excellent mechanical, electrical and chemical properties. In recent years, researches on epoxy resin/nanocomposites have shown that the presence of nano-size filler in epoxy resin system can improve electrical, thermal and mechanical properties significantly. In the present paper, the epoxy resin containing nanosize SiO2 and Al2O3 fillers were prepared and the influence of nanosize filler on nanocomposites electrical properties was investigated. The epoxy resin (LY556), commonly used in power apparatus, was used as the base material and nano-sized fillers were mechanically mixed into the epoxy resin. The influence of filler type, filler size and filler concentration on nanocomposites ac breakdown strength and space charge accumulation were examined. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the results were compared with those obtained from epoxy resin/nanocomposites. The present results show that the presence of nano-sized fillers affects space charge accumulation and ac breakdown strength shows a slight reduction. The dielectric properties are strongly influenced by the filler size type and concentration.
Keywords :
dielectric properties; electric breakdown; epoxy insulation; filled polymers; mechanical properties; nanocomposites; resins; space charge; base material; dielectric properties; electrical breakdown; electrical properties; epoxy resin; high voltage apparatus; insulation; mechanical properties; nanocomposite; nanofiller; space charge accumulation; thermal properties; Aluminum oxide; Charge measurement; Electric breakdown; Epoxy resins; Nanocomposites; Space charge; Breakdown; epoxy resin; nanocomposites; nanofillers; space charge;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2010 Annual Report Conference on
Conference_Location :
West Lafayette, IN
ISSN :
0084-9162
Print_ISBN :
978-1-4244-9468-2
Type :
conf
DOI :
10.1109/CEIDP.2010.5724024
Filename :
5724024
Link To Document :
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