Title :
Breakdown properties of epoxy nanodielectric
Author :
Tuncer, Enis ; Cantoni, Claudia ; More, Karren L. ; James, D. Randy ; Polizos, G. ; Sauers, I. ; Ellis, A.R.
Author_Institution :
Oak Ridge Nat. Lab., Oak Ridge, TN, USA
Abstract :
Recent developments in polymeric dielectric nanocomposites have shown that these novel materials can improve design of high voltage (hv) components and systems. Some of the improvements can be listed as reduction in size (compact hv systems), better reliability, high energy density, voltage endurance, and multifunctionality. Nanodielectric systems demonstrated specific improvements that have been published in the literature by different groups working with electrical insulation materials. In this paper we focus on the influence of in-situ synthesized titanium dioxide (TiO2) nanoparticles on the dielectric breakdown characteristics of an epoxy-based nanocomposite system. The in-situ synthesis of the particles creates small nanoparticles on the order of 10 nm with narrow size distribution and uniform particle dispersion in the matrix. The breakdown strength of the nanocomposite was studied as a function of TiO2 concentration at cryogenic temperatures. It was observed that between 2 and 6wt% yields high breakdown values for the nanodielectric.
Keywords :
cryogenic electronics; electric breakdown; insulating materials; nanocomposites; nanoparticles; titanium compounds; TiO2; breakdown property; breakdown strength; cryogenic temperature; dielectric breakdown; electrical insulation material; energy density; epoxy nanodielectric; epoxy-based nanocomposite system; high voltage component; high voltage system; nanodielectric system; nanoparticle; particle dispersion; polymeric dielectric nanocomposite; reliability; size reduction; voltage endurance; Cryogenics; Dielectrics; Electric breakdown; Nanocomposites; Nanoparticles; Resins;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2010 Annual Report Conference on
Conference_Location :
West Lafayette, IN
Print_ISBN :
978-1-4244-9468-2
DOI :
10.1109/CEIDP.2010.5724025