DocumentCode
2660025
Title
The study of an interaction of solid particles with various surfaces using TSM sensors
Author
Zhang, Qiliang ; Lec, Ryszard ; Pourrezaei, Kambiz
Author_Institution
Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
fYear
2003
fDate
4-8 May 2003
Firstpage
1001
Lastpage
1006
Abstract
The interaction of solid particles with various surfaces has been experiencing growing interest in the area of nanotechnology, colloidal science and biology. In this paper interactions of solid particles with various surfaces using piezoelectric thickness shear mode (TSM) sensors have been studied. A mechanical model has been presented to evaluate the effect of particle loading on the behavior of a TSM sensor. The main sources contributing to the interaction, such as Van der Waals force, gravitational force and electrostatic force, are discussed. Experimental results have shown that the resonant frequency of a TSM sensor depends on the coupling conditions of micro- or nano- particles loaded on the surfaces of a TSM sensor, which is predicted by the theoretical model. The results show that this TSM sensor technique can provide the information of the coupling, such as the binding energy between the particles and the sensor surfaces, and may promote the applications of TSM sensors in characterizing the properties of the loaded particles.
Keywords
binding energy; electric sensing devices; nanoparticles; piezoelectric devices; stainless steel; Van der Waals force; binding energy; biology; colloidal science; electrostatic force; gravitational force; mechanical model; microparticles; nanoparticles; nanotechnology; piezoelectric thickness shear mode sensors; resonant frequency; solid particles; Biological system modeling; Biology; Biosensors; Electrostatics; Force sensors; Gravity; Mechanical sensors; Nanotechnology; Sensor phenomena and characterization; Solids;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium and PDA Exhibition Jointly with the 17th European Frequency and Time Forum, 2003. Proceedings of the 2003 IEEE International
ISSN
1075-6787
Print_ISBN
0-7803-7688-9
Type
conf
DOI
10.1109/FREQ.2003.1275227
Filename
1275227
Link To Document