• DocumentCode
    2660561
  • Title

    Amorphous SiC as a structural layer in microbridge-based RF MEMS switches for use in software-defined radio

  • Author

    Scardelletti, M.C. ; Parro, R.J. ; Varaljay, N. ; Zimmerman, S. ; Zorman, C.A.

  • Author_Institution
    NASA Glenn Res. Center, Cleveland
  • fYear
    2007
  • fDate
    12-14 Dec. 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    SiC is an attractive material for MEMS due to its outstanding mechanical, chemical and electrical properties. Crystalline SiC films are typically deposited at temperatures > 900degC, however amorphous SiC (a-SiC) films are deposited at temperatures below 400degC by PECVD [1], thus enabling deposition on temperature-sensitive substrates, such as those incorporating buried metal electrode structures. For RF MEMS switch applications, SiC is particularly attractive for its chemical inertness, anti-stiction properties and mechanical stiffness. NASA expects to replace multiple receiver-based communications architectures with a single, software-defined radio (SDR). RF MEMS switches have the potential to add configurability and improved RF performance to SDR systems while reducing system complexity, size, and weight. The purpose of this study was to explore the use of a-SiC as a structural material in RF MEMS switches.
  • Keywords
    microswitches; silicon compounds; software radio; wide band gap semiconductors; amorphous SiC; buried metal electrode structures; chemical inertness; crystalline SiC films; microbridge-based RF MEMS switches; multiple receiver-based communications architectures; software-defined radio; structural layer; temperature-sensitive substrates; Amorphous materials; Chemicals; Communication switching; Crystalline materials; Mechanical factors; Micromechanical devices; Radiofrequency microelectromechanical systems; Silicon carbide; Switches; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2007 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4244-1892-3
  • Electronic_ISBN
    978-1-4244-1892-3
  • Type

    conf

  • DOI
    10.1109/ISDRS.2007.4422473
  • Filename
    4422473