DocumentCode
2660775
Title
Use of electrospinning to disperse nanosilica into silicone rubber
Author
Bian, Shanshan ; Jayaram, Shesha H. ; Cherney, Edward A.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
fYear
2010
fDate
17-20 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
Nanomaterials have attracted considerable attention due to their unique physicochemical properties. However, agglomerations of nanofillers in nanocomposites have hindered the potential improvements to their properties. A novel technique of infusing nanosilica into silicone rubber with reduced agglomeration is reported in this paper. The technique involves electrospinning of silicone fibers, embedded with nanosilica, and incorporating the fibers into silicone rubber. Compared to high shear mechanical mixing, a larger volume fraction of nanosilica can be dispersed more uniformly into silicone rubber by electrospinning. The morphology of nanosilica composites was characterized by means of scanning electron microscopy and thermal heating tests using an infrared laser suggest an improvement to the thermal conductivity. These results suggest that electrospinning can tear apart particle agglomerations thereby improving the dispersion of nanoparticles into silicone rubber matrix.
Keywords
disperse systems; electrospinning; filled polymers; heat treatment; laser materials processing; mixing; nanocomposites; nanofabrication; nanofibres; nanoparticles; scanning electron microscopy; silicon compounds; silicone rubber; surface morphology; thermal conductivity; SiO2; electrospinning; infrared laser processing; mixing; nanocomposites; nanofiller particle agglomerations; nanosilica dispersion; scanning electron microscopy; silicone rubber fibers; surface morphology; thermal conductivity; thermal heating test; Compounds; Dispersion; Mixers; Nanoparticles; Plastics; Rubber; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2010 Annual Report Conference on
Conference_Location
West Lafayette, IN
ISSN
0084-9162
Print_ISBN
978-1-4244-9468-2
Type
conf
DOI
10.1109/CEIDP.2010.5724089
Filename
5724089
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