• DocumentCode
    2660775
  • Title

    Use of electrospinning to disperse nanosilica into silicone rubber

  • Author

    Bian, Shanshan ; Jayaram, Shesha H. ; Cherney, Edward A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
  • fYear
    2010
  • fDate
    17-20 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Nanomaterials have attracted considerable attention due to their unique physicochemical properties. However, agglomerations of nanofillers in nanocomposites have hindered the potential improvements to their properties. A novel technique of infusing nanosilica into silicone rubber with reduced agglomeration is reported in this paper. The technique involves electrospinning of silicone fibers, embedded with nanosilica, and incorporating the fibers into silicone rubber. Compared to high shear mechanical mixing, a larger volume fraction of nanosilica can be dispersed more uniformly into silicone rubber by electrospinning. The morphology of nanosilica composites was characterized by means of scanning electron microscopy and thermal heating tests using an infrared laser suggest an improvement to the thermal conductivity. These results suggest that electrospinning can tear apart particle agglomerations thereby improving the dispersion of nanoparticles into silicone rubber matrix.
  • Keywords
    disperse systems; electrospinning; filled polymers; heat treatment; laser materials processing; mixing; nanocomposites; nanofabrication; nanofibres; nanoparticles; scanning electron microscopy; silicon compounds; silicone rubber; surface morphology; thermal conductivity; SiO2; electrospinning; infrared laser processing; mixing; nanocomposites; nanofiller particle agglomerations; nanosilica dispersion; scanning electron microscopy; silicone rubber fibers; surface morphology; thermal conductivity; thermal heating test; Compounds; Dispersion; Mixers; Nanoparticles; Plastics; Rubber; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2010 Annual Report Conference on
  • Conference_Location
    West Lafayette, IN
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4244-9468-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2010.5724089
  • Filename
    5724089