• DocumentCode
    2660863
  • Title

    Tackling reliability of power module

  • Author

    He, Weikun Jimmy ; Vass-Varnai, Andras ; Wilson, John

  • Author_Institution
    Mech. Anal. Div., Mentor Graphics Corp., Fremont, CA, USA
  • fYear
    2015
  • fDate
    15-19 March 2015
  • Firstpage
    2931
  • Lastpage
    2933
  • Abstract
    Power modules are used in many of today´s applications: automotive, renewable energy resources, and railway traction. The power module market will continue to grow as the industry is going towards zero carbon emissions. To ensure those products last 15 to 30 years, reliability of the power modules is extremely important. Design for reliability is not an obvious task, as the current trends include the reduction of the die sizes, module, while the power is still increasing. This results in growing power densities, so proper thermal management is an increasingly important task in today´s power module design. This paper will demonstrate how thermal transient testing can help identify the root cause of power module failure in a system environment. This non-destructive technique can also be used to assess the thermal performance of aging components and highlight any material degradation.
  • Keywords
    ageing; power system reliability; aging components; automotive; material degradation; nondestructive technique; power densities; power module design; railway traction; renewable energy resources; tackling reliability; thermal management; thermal transient testing; zero carbon emissions; Delamination; Insulated gate bipolar transistors; Multichip modules; Reliability; Temperature measurement; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2015 IEEE
  • Conference_Location
    Charlotte, NC
  • Type

    conf

  • DOI
    10.1109/APEC.2015.7104767
  • Filename
    7104767