DocumentCode :
2661015
Title :
Nanofiller effect during post-heat treatmentof micro-loaded epoxy
Author :
Couderc, H. ; Fréchette, M.F. ; Savoie, S. ; David, E.
Author_Institution :
Ecole de Technol. Super. (ETS), Montreal, QC, Canada
fYear :
2010
fDate :
17-20 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
Samples of epoxy filled with micrometric quartz were prepared with or without the addition of a small amount of nanoclay, in regard to the quartz content. The influence of the nanofiller on heat treatment after curing was characterized using dielectric spectroscopy. It was put in evidence that the addition of nanofillers caused an increase of the relaxation time of the α relaxation process, altered the kinetic of the post-curing and of the water diffusion processes but did not affect the β relaxation rate.
Keywords :
curing; dielectric relaxation; diffusion; filled polymers; heat treatment; quartz; resins; SiO2; curing; dielectric spectroscopy; diffusion; microloaded epoxy; micrometric quartz; nanoclay; nanofiller effect; post-heat treatment; relaxation process; Curing; Dielectrics; Fitting; Permittivity; Plastics; Spectroscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2010 Annual Report Conference on
Conference_Location :
West Lafayette, IN
ISSN :
0084-9162
Print_ISBN :
978-1-4244-9468-2
Type :
conf
DOI :
10.1109/CEIDP.2010.5724103
Filename :
5724103
Link To Document :
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