• DocumentCode
    2661197
  • Title

    Accurate speed improvement techniques for RC line and tree interconnections in CMOS VLSI

  • Author

    Wu, Chunq-Yu ; Shaiu, Ming-Chuen

  • Author_Institution
    Nat. Chiao Tung Unv., Hsin-Chu, Taiwan
  • fYear
    1990
  • fDate
    1-3 May 1990
  • Firstpage
    1648
  • Abstract
    A physical delay model for small-geometry CMOS inverters with RC tree interconnection networks is presented. Through extensive comparisons with SPICE simulation results, it is shown that the maximum relative error in delay-time calculations using the model is within 15% for 1.5-μm CMOS inverters with RC tree interconnection networks. Moreover, the model has a wide applicable range of circuit and device parameters. An experimental sizing program is constructed for speed improvement of interconnection lines and trees. In this program, given the size of the input logic gate and its driving interconnection resistances, capacitances, and structures, users can choose one of four speed improvement techniques and determine the suitable sizes and/or number of drivers/repeaters for a minimum delay. It is found that the required tapering factor in cascaded drivers is not e (the base of the natural logarithm) but a value in the range 4-8. Moreover, adding a small number of drivers/repeaters with large size is more efficient in reducing the interconnection delay. It is also shown that the technique of optimal-size repeaters with cascaded input drivers can lead to the lowest delay
  • Keywords
    CMOS integrated circuits; VLSI; circuit layout CAD; delays; integrated logic circuits; logic CAD; semiconductor device models; 1.5 micron; CAD; CMOS VLSI; RC tree interconnection networks; delay-time calculations; layout design; logic design; physical delay model; sizing program; small-geometry CMOS inverters; speed improvement techniques; CMOS logic circuits; Circuit simulation; Delay; Integrated circuit interconnections; Inverters; Logic gates; Multiprocessor interconnection networks; Repeaters; SPICE; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1990., IEEE International Symposium on
  • Conference_Location
    New Orleans, LA
  • Type

    conf

  • DOI
    10.1109/ISCAS.1990.112454
  • Filename
    112454