DocumentCode

2662641

Title

Rework of Wire Bonded Devices on Mcms

Author

Proietti-Bowne, Camille ; Elenius, Peter

Author_Institution

IBM Microelectronics Division, NY

fYear

1994

fDate

13-15 Apr 1994

Firstpage

61

Lastpage

66

Keywords

Atherosclerosis; Bonding; Cost function; Microassembly; Microelectronics; Process control; Production; Thin film devices; Wire; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753530

Filename

753530