• DocumentCode
    2662676
  • Title

    Cost Implications of Large Area MCM Processing

  • Author

    Frye, Donald C. ; Skinner, Michael P. ; Heistand, Robert H., II ; Garrou, Philip E. ; Tessier, T.G.

  • Author_Institution
    The Dow Chemical Company, NC
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    69
  • Lastpage
    80
  • Keywords
    Chemical processes; Coatings; Conducting materials; Costs; Dielectric materials; Dielectric substrates; Dielectric thin films; Fabrication; Flat panel displays; Sensitivity analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753532
  • Filename
    753532
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2662676