DocumentCode

2662768

Title

Cu/Photosensitive-BCB Thin-Film Multilayer Technology for High-Performance Multichip Module

Author

Shimoto, Tadanori ; Matsui, Koji ; Utsumi, Kazuaki

Author_Institution

Material Development Center, NEC Corporation, Japan

fYear

1994

fDate

13-15 Apr 1994

Firstpage

115

Lastpage

120

Keywords

Adhesives; Conductors; Costs; Fabrication; Multichip modules; Nonhomogeneous media; Prototypes; Reduced instruction set computing; Testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753538

Filename

753538