DocumentCode

2662851

Title

The TCC/MCM: μBGA on a laminated substrate

Author

Martinez, Marcelo ; Gibson, David ; Matthew, Linda ; DiStefano, Thomas ; Cofield, John

Author_Institution

Tessera, Inc., CA

fYear

1994

fDate

13-15 Apr 1994

Firstpage

161

Lastpage

166

Keywords

Assembly; Costs; Crosstalk; Drives; Electronics packaging; Graphics; Lamination; Process control; Surface-mount technology; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753545

Filename

753545