Title :
Mechanical Punching of Through-Holes in Thin Laminates for Higher Density MCM-L Fabrication
Author :
Tessier, T.G. ; Adams, Bill
Author_Institution :
Unichem Industries Inc., California
Keywords :
Copper; Costs; Dielectric substrates; Fabrication; Laminates; Manufacturing industries; Manufacturing processes; Pulp manufacturing; Punching; Space technology;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753547
