DocumentCode
2662922
Title
Interconnected Mesh Power System, (IMPS) A Packaging and Interconnection Application
Author
Reynolds, Carl V. ; Schaper, Leonard W.
Author_Institution
High Density Electronics Center, University of Arkansas
fYear
1994
fDate
13-15 Apr 1994
Firstpage
188
Lastpage
192
Keywords
Availability; Costs; Electronics packaging; Impedance; Industrial power systems; Integrated circuit interconnections; Manufacturing; Power system interconnection; Power system reliability; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753549
Filename
753549
Link To Document