DocumentCode
2662966
Title
Testing Multichip Modules and Bare Die Using Vision Probing Techniques
Author
Place, Denis
Author_Institution
KARL SUSS AMERICA, VT
fYear
1994
fDate
13-15 Apr 1994
Firstpage
211
Lastpage
216
Keywords
Automatic testing; Circuit testing; Costs; Machine vision; Multichip modules; Optical sensors; Performance evaluation; Probes; Semiconductor device manufacture; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753553
Filename
753553
Link To Document