DocumentCode

2663044

Title

High Performance Elastic Connection for Reliable Device Testing

Author

Hiwada, Kiyoyasu ; Tamura, Takeshi

Author_Institution

Yokogawa Hewlett Packard, Ltd., Japan

fYear

1994

fDate

13-15 Apr 1994

Firstpage

242

Lastpage

247

Keywords

Biomembranes; Circuit testing; Contacts; Frequency; High speed integrated circuits; Isolation technology; Packaging; Rubber; Shape; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753557

Filename

753557