DocumentCode :
2663090
Title :
Uses of polyimide for micromachining applications
Author :
Frazier, A. Bruno
Author_Institution :
Sch. of Electr. Eng., Louisiana Tech. Univ., Ruston, LA, USA
Volume :
3
fYear :
1994
fDate :
5-9 Sep 1994
Firstpage :
1483
Abstract :
In this paper, applications of polyimide materials to micromachining technology is reviewed. First, the use of both photosensitive and nonphotosensitive polyimides as electroplating molds for the fabrication of thick and high aspect ratio metallic microstructures is presented, Electroplated microstructures of different metals realized using these technologies are shown. In addition, various applications of this technology that have been realized are discussed. Second, the use of polyimide materials as integral parts of micromachined devices is presented. Emphasis is given to the development of a piezoresistive composite of polyimide/graphite for sensor applications
Keywords :
electroplating; filled polymers; micromachining; micromechanical devices; micromotors; microsensors; optical polymers; piezoresistive devices; polymer films; electroplated microstructures; electroplating molds; micromachining; nonphotosensitive polyimides; photosensitive polyimides; piezoresistive polyimide/graphite composite; sensor applications; thick high-aspect-ratio metallic microstructures; Costs; Dielectric materials; Fabrication; Inorganic materials; Microelectronics; Micromachining; Microstructure; Polyimides; Stability; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, Control and Instrumentation, 1994. IECON '94., 20th International Conference on
Conference_Location :
Bologna
Print_ISBN :
0-7803-1328-3
Type :
conf
DOI :
10.1109/IECON.1994.398033
Filename :
398033
Link To Document :
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