DocumentCode
2663090
Title
Uses of polyimide for micromachining applications
Author
Frazier, A. Bruno
Author_Institution
Sch. of Electr. Eng., Louisiana Tech. Univ., Ruston, LA, USA
Volume
3
fYear
1994
fDate
5-9 Sep 1994
Firstpage
1483
Abstract
In this paper, applications of polyimide materials to micromachining technology is reviewed. First, the use of both photosensitive and nonphotosensitive polyimides as electroplating molds for the fabrication of thick and high aspect ratio metallic microstructures is presented, Electroplated microstructures of different metals realized using these technologies are shown. In addition, various applications of this technology that have been realized are discussed. Second, the use of polyimide materials as integral parts of micromachined devices is presented. Emphasis is given to the development of a piezoresistive composite of polyimide/graphite for sensor applications
Keywords
electroplating; filled polymers; micromachining; micromechanical devices; micromotors; microsensors; optical polymers; piezoresistive devices; polymer films; electroplated microstructures; electroplating molds; micromachining; nonphotosensitive polyimides; photosensitive polyimides; piezoresistive polyimide/graphite composite; sensor applications; thick high-aspect-ratio metallic microstructures; Costs; Dielectric materials; Fabrication; Inorganic materials; Microelectronics; Micromachining; Microstructure; Polyimides; Stability; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, Control and Instrumentation, 1994. IECON '94., 20th International Conference on
Conference_Location
Bologna
Print_ISBN
0-7803-1328-3
Type
conf
DOI
10.1109/IECON.1994.398033
Filename
398033
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