• DocumentCode
    2663090
  • Title

    Uses of polyimide for micromachining applications

  • Author

    Frazier, A. Bruno

  • Author_Institution
    Sch. of Electr. Eng., Louisiana Tech. Univ., Ruston, LA, USA
  • Volume
    3
  • fYear
    1994
  • fDate
    5-9 Sep 1994
  • Firstpage
    1483
  • Abstract
    In this paper, applications of polyimide materials to micromachining technology is reviewed. First, the use of both photosensitive and nonphotosensitive polyimides as electroplating molds for the fabrication of thick and high aspect ratio metallic microstructures is presented, Electroplated microstructures of different metals realized using these technologies are shown. In addition, various applications of this technology that have been realized are discussed. Second, the use of polyimide materials as integral parts of micromachined devices is presented. Emphasis is given to the development of a piezoresistive composite of polyimide/graphite for sensor applications
  • Keywords
    electroplating; filled polymers; micromachining; micromechanical devices; micromotors; microsensors; optical polymers; piezoresistive devices; polymer films; electroplated microstructures; electroplating molds; micromachining; nonphotosensitive polyimides; photosensitive polyimides; piezoresistive polyimide/graphite composite; sensor applications; thick high-aspect-ratio metallic microstructures; Costs; Dielectric materials; Fabrication; Inorganic materials; Microelectronics; Micromachining; Microstructure; Polyimides; Stability; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, Control and Instrumentation, 1994. IECON '94., 20th International Conference on
  • Conference_Location
    Bologna
  • Print_ISBN
    0-7803-1328-3
  • Type

    conf

  • DOI
    10.1109/IECON.1994.398033
  • Filename
    398033