• DocumentCode
    2663091
  • Title

    AT&T spl mu/Surface Mount Assembly: A New Technology for the Large Volume Fabrication of Cost Effective Flip-Chip MCMs

  • Author

    Dudderar, T.D. ; Degani, Y. ; Spadafora, J.G. ; Tai, K.L. ; Frye, R.C.

  • Author_Institution
    AT&T Bell Laboratories, Murray Hill, NJ
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    266
  • Lastpage
    272
  • Keywords
    Assembly; Ceramics; Costs; Fabrication; Integrated circuit interconnections; Packaging; Silicon; Substrates; Surface-mount technology; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753561
  • Filename
    753561
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663091