• DocumentCode
    2663227
  • Title

    MCM-L Cost Model & Application Case Study

  • Author

    Begay, Marlene J. ; Cantwell, Robert

  • Author_Institution
    DSC Communications Corporation, TX
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    332
  • Lastpage
    337
  • Keywords
    Application specific integrated circuits; Computer aided software engineering; Costs; Multichip modules; Packaging machines; Plastic packaging; Semiconductor device packaging; Switches; System analysis and design; Telecommunication switching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753571
  • Filename
    753571
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663227