• DocumentCode
    2663281
  • Title

    Stress Development During High Dielectric Ceramic Thin Films Processing

  • Author

    Boggs, Karl E. ; Wilcox, David L. ; Payne, David A. ; Allen, Les H.

  • Author_Institution
    University of Illinois, Urbana-Champaign
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    350
  • Lastpage
    355
  • Keywords
    Capacitance; Capacitors; Ceramics; Dielectric materials; Dielectric substrates; Dielectric thin films; Ferroelectric materials; Packaging; Stress; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753574
  • Filename
    753574
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663281