• DocumentCode
    2663420
  • Title

    Mcm-L Technologies: Myths and Experiences in Multiple Product Scenarios

  • Author

    Carey, David ; Hashemi, Hassan ; Hunter, Paul

  • Author_Institution
    Microelectronics and Computer Technology Corporation (MCC), Texas
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    416
  • Lastpage
    423
  • Keywords
    Application software; Bonding; Circuit testing; Costs; Integrated circuit interconnections; Multichip modules; Packaging; Printed circuits; Space technology; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753584
  • Filename
    753584
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663420