DocumentCode
2663440
Title
Wire Bonding Dual-Sided Mcma Modules
Author
Anderson, Harold
Author_Institution
Advanced Packaging Development & Automation Center, Motorola Inc., Arizona
fYear
1994
fDate
13-15 Apr 1994
Firstpage
424
Lastpage
429
Keywords
Application specific integrated circuits; Assembly; Bonding; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Space technology; Substrates; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753585
Filename
753585
Link To Document