DocumentCode

2663491

Title

Mcm-L Product Development Process for Low-Cost Mcms

Author

Thompson, Patrick

Author_Institution

Core Technologies, Motorola, AZ

fYear

1994

fDate

13-15 Apr 1994

Firstpage

449

Lastpage

454

Keywords

Assembly; Copper; Costs; Maintenance; Multichip modules; Nonhomogeneous media; Packaging; Product development; Qualifications; Resins;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753588

Filename

753588