Title :
Mcm-L Product Development Process for Low-Cost Mcms
Author :
Thompson, Patrick
Author_Institution :
Core Technologies, Motorola, AZ
Keywords :
Assembly; Copper; Costs; Maintenance; Multichip modules; Nonhomogeneous media; Packaging; Product development; Qualifications; Resins;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753588
