DocumentCode

2663505

Title

Chip on Board Technology for Low Cost Multi-Chip-Modules

Author

Clot, Philippe ; Sarbach, Pierre ; Styblo, Donald

Author_Institution

Valtronic USA Inc., Ohio

fYear

1994

fDate

13-15 Apr 1994

Firstpage

455

Lastpage

460

Keywords

Cost function; Electronics packaging; Finite element methods; Glass; Heat sinks; Paper technology; Pins; Soldering; Thermal resistance; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753589

Filename

753589