DocumentCode
2663640
Title
Ball Grid Array Ceramic Packages
Author
Danner, Paul
Author_Institution
Pacific Microelectronics, Corp., Oregon
fYear
1994
fDate
13-15 Apr 1994
Firstpage
510
Lastpage
513
Keywords
Assembly; Ceramics; Costs; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Microelectronics; Printed circuits; Surface tension; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753598
Filename
753598
Link To Document