Title :
Ball Grid Array Ceramic Packages
Author_Institution :
Pacific Microelectronics, Corp., Oregon
Keywords :
Assembly; Ceramics; Costs; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Microelectronics; Printed circuits; Surface tension; Temperature;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753598
