DocumentCode
2663659
Title
Effects of Ceramic Ball-Grid-Array Package´s Manufacturing Variations on Solder Joint Reliability
Author
Ju, T.H. ; Lee, Y.C.
Author_Institution
University of Colorado - Boulder
fYear
1994
fDate
13-15 Apr 1994
Firstpage
514
Lastpage
519
Keywords
Ceramics; Computer aided manufacturing; Electronics packaging; Fatigue; Grid computing; Mechanical engineering; Predictive models; Soldering; Virtual manufacturing; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753599
Filename
753599
Link To Document