Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array

Author

Banks, Donald R. ; Bunette, T.E. ; Gerke, R. David ; Mammo, Ephraim ; Mattay, Shyam

Author_Institution

Motorola, Inc., Texas

fYear

1994

fDate

13-15 Apr 1994

Firstpage

529

Lastpage

534

Keywords

Assembly; Capacitive sensors; Ceramics; Copper; Electronics packaging; Failure analysis; Fatigue; Manufacturing processes; Soldering; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

DOI

10.1109/ICMCM.1994.753601

Filename

753601

Link To Document