Title :
Choosing an Mcm Technology for Thermal Performance
Author :
Demmin, Jeffrey C.
Author_Institution :
nCHIP, Inc., CA
Keywords :
Ceramics; Dielectric materials; Dielectric substrates; Dielectric thin films; Finite element methods; Multichip modules; Packaging; Performance analysis; Thermal conductivity; Thermal management;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753604
