Title :
A Four Asic Mcm-c, the "Kiss" Principle, and the Next Generation Silicon
Author :
Fulcher, Ed ; Patil, Sada
Author_Institution :
LSI Logic, Fremont, California
Keywords :
Application specific integrated circuits; Ceramics; Costs; Large scale integration; Logic devices; Packaging; Pins; Silicon; Testing; Workstations;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753608
