DocumentCode

2663853

Title

Integrated Brazed Ltcc Packages

Author

Kovacs, Alan L. ; Elwell, Dennis F.

Author_Institution

Hughes Aircraft Company, California

fYear

1994

fDate

13-15 Apr 1994

Firstpage

591

Lastpage

596

Keywords

Aerospace electronics; Aircraft; Ceramics; Costs; Microelectronics; Packaging; Routing; Sealing materials; Seals; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753613

Filename

753613