• DocumentCode
    2663869
  • Title

    Dual-use Microelectronics Manufacturing Specification for Single and Multichip Packaging Technologies

  • Author

    Gorniak, Mark J. ; Fayette, Daniel F. ; Farrell, J.P.

  • Author_Institution
    Rome Laboratory, NY
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    597
  • Lastpage
    602
  • Keywords
    Gallium arsenide; Hybrid integrated circuits; Laboratories; Manufacturing industries; Microelectronics; Multichip modules; Plastic packaging; Qualifications; Quality assurance; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753614
  • Filename
    753614