DocumentCode
2663869
Title
Dual-use Microelectronics Manufacturing Specification for Single and Multichip Packaging Technologies
Author
Gorniak, Mark J. ; Fayette, Daniel F. ; Farrell, J.P.
Author_Institution
Rome Laboratory, NY
fYear
1994
fDate
13-15 Apr 1994
Firstpage
597
Lastpage
602
Keywords
Gallium arsenide; Hybrid integrated circuits; Laboratories; Manufacturing industries; Microelectronics; Multichip modules; Plastic packaging; Qualifications; Quality assurance; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753614
Filename
753614
Link To Document