• DocumentCode
    2663935
  • Title

    Demonstration of a High Heat Removal Cvd Diamond Substrate Edge-Cooled Multichip Module

  • Author

    Peterson, David W. ; Sweet, James N. ; Andaleon, David D. ; Renzi, Ronald F. ; Johnson, Donald R.

  • Author_Institution
    Sandia National Laboratories, NM
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    624
  • Lastpage
    630
  • Keywords
    Heat transfer; Laboratories; Materials testing; Multichip modules; Substrates; Temperature measurement; Temperature sensors; Thermal conductivity; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753618
  • Filename
    753618
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663935