Title :
The current state of laminate based, molded MCM technology
Author :
Rogren, Philip E.
Author_Institution :
Hestia Technol., Sunnyvale, CA, USA
Abstract :
Laminate technology has progressed to the point where it is capable of producing multichip module (MCM) substrates that can compete favorably with both cofire ceramic and thin film. By virtue of the properties of the materials set and flexibility of the process, laminate based MCM offer superior electrical performance. Laminates can be expected to be faster than either cofire ceramic or thin film and will be significantly less noise than ceramic based MCMs. In terms of thermal performance, several levels of thermal enhancements available on laminate substrates keep pace with similar methods available for ceramic or metal packages
Keywords :
economics; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; laminates; multichip modules; plastic packaging; reviews; substrates; cost; electrical performance; laminate based; laminate substrates; molded MCM technology; reliability; thermal enhancements; thermal performance; Ceramics; Circuits; Costs; Laminates; Plastics; Protection; Semiconductor device packaging; Substrates; Thermal conductivity; Wiring;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398158
