Low cost multi-chip modules based on single and double sided chip-on-board modules following Jedec standard specifications

Author

Clot, Philippe

Author_Institution

VALTRONIC, SA, Les Charbonnieres, Switzerland

fYear

1993

fDate

4-6 Oct 1993

Firstpage

477

Lastpage

480

Abstract

The author explains how two original designs using chip-on-board technology have been completed and pushed into production. Both are made on the same kind of modified multilayer glass epoxy. One is equipped with J lead output pins, allowing the mounting of silicon dice on both faces of the printed circuit board; the second supports dice on the top only, the bottom face being reserved for direct surface mount device (SMD) soldering carefully prepared for this purpose. Design rules, dimensions regarding Jedec standard, mounting procedures as well as qualification program and test approach are described. Considerations on the choice of dice epoxy coatings are explained. Dispensing and machining are defined to allow pick and place handling by automatic machine

Keywords

application specific integrated circuits; hybrid integrated circuits; integrated circuit packaging; multichip modules; polymer films; reflow soldering; standards; surface mount technology; ASIC; Jedec standard specifications; Si dice; automatic machine; chip-on-board modules; design rules; dice epoxy coatings; dimensions; direct SMD soldering; dispensing; double sided; flexibility; low cost MCM; machining; modified multilayer glass epoxy; multi-chip-carrier-module; pick and place handling; qualification program; reflow soldering; single sided modules; test approach; Costs; Glass; Lead; Nonhomogeneous media; Pins; Printed circuits; Production; Qualifications; Silicon; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398161

Filename

398161