DocumentCode :
2665203
Title :
A complete device dedicated to ECG signal measurement with integrated 3D Hall sensor for signal correction
Author :
Pillet, Nicolas ; Ayachi, Mohsen ; Frick, VIncent ; Berviller, Hervé ; Felblinger, Jacques ; Blondé, Jean Philippe
Author_Institution :
InESS-UdS, CNRS, Strasbourg, France
fYear :
2010
fDate :
12-15 Dec. 2010
Firstpage :
227
Lastpage :
230
Abstract :
This paper presents a fully integrated device for ECG acquisition on an MRI environment with on chip 3D HALL sensor for signal correction submitted in standard 0.35 μm CMOS technology. Based on a CMOS current conveyor (60 μA @ ± 1.65 V power supply, 100 MHz bandwidth and 10 GHz equivalent GBW circuit) the instrumentation amplifier used in this IC he circuit. The 3D Hall sensor features two vertical Hall devices (VHD) to measure component of the magnetic field oriented in the plane of the chip as well as one horizontal Hall device (HHD) to measure the component of the field orthogonally oriented to the plane of the chip. The 3D Hall sensor allows measuring the static field up to 1.5 T as well as the magnetic pulses of ± 20 mT generated during the MRI acquisition. The size of the complete design makes biological signal measurement in very hostile environment such MRI possible.
Keywords :
CMOS integrated circuits; Hall effect devices; biomedical MRI; biomedical electronics; biomedical equipment; current conveyors; data acquisition; electric sensing devices; electrocardiography; medical signal processing; CMOS current conveyor; CMOS technology; ECG acquisition; ECG signal measurement; MRI environment; bandwidth 10 GHz; bandwidth 100 MHz; biological signal measurement; current 60 muA; fully integrated device; integrated 3D Hall sensor; magnetic flux density 1.5 T; signal correction; size 0.35 mum; vertical Hall devices; voltage 1.65 V; Lead; Switches; 3D Hall probe; CMOS; Current conveyor; ECG; Magnetic Resonant Imaging (MRI);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Circuits, and Systems (ICECS), 2010 17th IEEE International Conference on
Conference_Location :
Athens
Print_ISBN :
978-1-4244-8155-2
Type :
conf
DOI :
10.1109/ICECS.2010.5724495
Filename :
5724495
Link To Document :
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