Title :
Laminate substrates for high speed interconnect
Author_Institution :
Texas Instruments, Inc., Dallas, TX, USA
Abstract :
An existing dual C40 multichip module (MCM) design, constructed in thin film HDI on ceramic is compared with the design converted to a laminate interconnect. The resulting design combines the low cost laminate substrate with increased power distribution and fine interconnect geometries
Keywords :
laminates; multichip modules; printed circuit design; substrates; PWB concept; ceramic; dual C40 multichip module; fine interconnect geometries; high speed interconnect; increased power distribution; laminate interconnect; low cost laminate substrate; thin film HDI; Ceramics; Costs; Dielectric substrates; Instruments; Integrated circuit interconnections; Laminates; Optical design; Packaging; Pins; Resists;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398171
