Title :
High-density and high-pin count flexible SMD connector for high-speed data bus
Author :
Sasaki, Shinichi ; Kishimoto, Tohru
Author_Institution :
NTT Commun. Switching Lab., Musashino-shi, Tokyo, Japan
Abstract :
A high-density high-pin-count flexible surface mount device (SMD) connector used for high-speed data buses between multichip modules (MCMs) or daughter boards is described. This connector consists of flexible film cable interconnection that has accurately controlled characteristic impedance and contact housing composed of double-line contacts and SMT type leads. It has 98 contacts each with a pitch of 0.4 mm. This connector mounting area is 6-mm wide and 23-mm long. The flexible cable has a double-sided tri-plate micro strip-line structure with insertion force of less than 3.9 kg and characteristic impedance of 48 to 50 Ω. Insertion loss is -0.5 dB at 600 MHz and crosstalk noise is less than 110 mV at 250 ps rising time. This connector can be applied for high-speed data transmission of up to 300 ps rising time
Keywords :
electric connectors; multichip modules; printed circuit accessories; surface mount technology; system buses; -0.5 dB; 300 ps; 48 to 50 ohm; 600 MHz; SMT type leads; controlled characteristic impedance; crosstalk noise; daughter boards; double-line contacts; flexible SMD connector; flexible film cable interconnection; high-density; high-pin count; high-speed data bus; high-speed data transmission; insertion loss; multichip modules; tri-plate micro strip-line structure; Communication switching; Connectors; Contacts; Data communication; Flexible printed circuits; Impedance; Integrated circuit interconnections; Laboratories; Power cables; Surface-mount technology;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398173
