Title :
Tape automated bonded chip on MCM-D
Author :
Chung, Tom ; Chang, James ; Emamjomeh, Ali
Author_Institution :
Tandem Comput. Inc., Cupertino, CA, USA
Abstract :
Tape automated bonding (TAB) is an integrated circuit (IC) chip-level interconnect technology. An in-depth overview of TAB chip on board technology and related applications is presented. Key considerations of design, materials, assembly, and equipment for TAB chip on multichip module (MCM)-D are discussed in detail. The issues, pros and cons, problems and solutions, and guidelines are provided to examine a variety of applications. Examples of both face-up and flipped TAB chip on MCM-D applications are presented and discussed. Future trends of TAB technology are also discussed
Keywords :
integrated circuit interconnections; integrated circuit packaging; lead bonding; multichip modules; reviews; tape automated bonding; IC chip-level interconnect technology; TAB chip on MCM-D; TAB chip on board technology; assembly; design; face-up; flipped; materials; Application software; Assembly; Bonding; Guidelines; Integrated circuit interconnections; Integrated circuit technology; Packaging; Sockets; Testing; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398190
