Title :
Limits of high density, low-force pressure contacts
Author :
Beale, John ; Pease, R. Fabian
Author_Institution :
Solid State Electron. Lab., Stanford Univ., CA, USA
Abstract :
The prosaic pressure contact is a source of unreliability not only in completed systems but more seriously in testing of ICs prior to packaging. Using a custom-built apparatus, pressure contacts are characterized with applied forces down to a few nN and contact areas down to 10-11 cm2. Nominally clean gold-gold and iridium-gold contacts in air exhibit resistivities higher than that predicted from a simple model based on the plastic deformation of the gold. Interfacial films appear to be a source of unreliability. The surface film on gold in air appears to disrupt conduction to a similar degree
Keywords :
atomic force microscopy; contact resistance; electrical contacts; microscopy; nanotechnology; reliability; surface contamination; surface phenomena; Au; Au-Au; Ir-Au; LB films; constriction resistance; customised AFM; high density; insulating film effects; interfacial films; low-force pressure contacts; microcontacts; nanomechanics; nanoscale electrical contacts; source of unreliability; Atomic force microscopy; Conductive films; Contacts; Electrical resistance measurement; Electronic equipment testing; Electronics packaging; Gold; Plastics; Polymer films; Surface topography;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398210