Solder replacement

Author

Hvims, Henrik L.

Author_Institution

Danish Res. Centre for Appl. Electron., Hoersholm, Denmark

fYear

1993

fDate

4-6 Oct 1993

Firstpage

128

Lastpage

135

Abstract

The use of conductive adhesives as a replacement for solder on surface mount technology (SMT) printed circuit boards is discussed. A number of conductive adhesives has been selected. One of the two key issues is to uncover the market for adhesive types and their composition. The other is the technical investigation of the influence of component termination and printed circuit surface types on adhesive bonding stability. Four different types of adhesives on two different metal surfaces are compared with conventional solder technology. All adhesive variants are microsectioned for metallurgical and microstructure examination. Energy dispersive analysis of X-ray (EDAX) of the metal particles in the adhesive is carried out and documented. Rework of conductive joints is briefly reported. Aspects of occupational health are discussed concerning work with adhesive types. Work with epoxy based adhesives is discussed

Keywords

adhesion; conducting polymers; environmental factors; filled polymers; materials testing; printed circuit manufacture; silicones; soldering; surface mount technology; EDAX; adhesive bonding stability; adhesive types; component termination; composition; conductive adhesives; disassembling; environmental issues; epoxy based adhesives; market survey; metal filled polymers; metal particles; microstructure; occupational health; polymer type; printed circuit boards; printed circuit surface types; rework; silicone type; solder replacement; surface mount technology; Assembly; Bonding; Conductive adhesives; Consumer electronics; Industrial electronics; Lead; Manufacturing; Printed circuits; Surface-mount technology; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-1424-7

Type

conf

DOI

10.1109/IEMT.1993.398211

Filename

398211