Title :
A new method for measuring the tin content of flip-chip solder bumps
Author :
Kato, Haruo ; Ikuzaki, Kunihiko ; Tsujita, Masahiko ; Nakata, Kensuke ; Kobayashi, Tsuneo ; Sano, Yoshiyuki
Author_Institution :
Hitachi, LTd., Tokyo, Japan
Abstract :
A new method for measuring the tin content of flip-chip solder bumps is described. This method uses a combination of gravimetric analysis and fluorescent X-ray spectrometry, which allows it to measure low Sn ratio of less than 2%. It also improves the repeatability to 0.2% compared with 4.3% for conventional methods that use integrated circuit piezoelectric (ICP) atomic emission spectrometry. This method also reduces the measurement time by 75%
Keywords :
X-ray fluorescence analysis; chemical variables measurement; flip-chip devices; large scale integration; reflow soldering; tin alloys; weighing; LSI; PbSn; Sn content measurement; flip-chip solder bumps; fluorescent X-ray spectrometry; gravimetric analysis; measurement time; repeatability; Absorption; Atomic layer deposition; Atomic measurements; Calibration; Chemical vapor deposition; Oscillators; Spectroscopy; Thickness control; Thickness measurement; Tin;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398213
