Title :
Effect of molding compound/polyimide interfacial chemistry on TSOP delamination
Author :
Hagen, Debbie ; Prack, Ed ; Tran, Ziep
Author_Institution :
Motorola, Inc., Austin, TX, USA
Abstract :
The effect of interfacial chemistry on plastic package delamination is investigated. The effect of cleaning treatments, molding compound types and polyimide die coating types is examined. Delamination is induced by subjecting a TSOP package with a large die to a simulated board mounting process. Stressing consists of moisture saturation at 75% RH at room temperature followed by vapor phase reflow. The best combination of materials and processes examined results in a TSOP package with no delamination after moisture saturation and vapor phase reflow
Keywords :
adhesion; delamination; environmental degradation; environmental factors; plastic packaging; polymer films; printed circuit manufacture; surface mount technology; TSOP delamination; cleaning treatments; interfacial adhesion; interfacial chemistry; moisture saturation; molding compound types; plastic package delamination; polyimide die coating types; simulated board mounting process; thin SOP; vapor phase reflow; Adhesives; Chemistry; Cleaning; Delamination; Moisture; Packaging; Plastics; Polyimides; Stress; Surface cracks;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398218
