Title :
Obtaining high quality VLSI packages with QFD
Author :
Pearsall, Kitty ; Raines, Robert ; Schoellmann, Matthew
Author_Institution :
IBM, Austin, TX, USA
Abstract :
Component end users want a high quality, reliable part. However, the expected failure rate, cost etc. may vary from one customer to the next. The amount of control that a packaging vendor is expected to put in place so that he can meet those requirements can be assessed through the implementation of QFD (quality function deployment). One such work effort that strives to use this technique for the definition and subsequent optimization of these controls for delivering high quality PQFP´s (plastic quad flat packs) is described
Keywords :
VLSI; integrated circuit packaging; plastic packaging; quality control; high quality VLSI packages; plastic quad flat packs; quality function deployment; Assembly; Electronics packaging; Manufacturing processes; Plastic packaging; Process control; Qualifications; Quality function deployment; Reliability engineering; Testing; Very large scale integration;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398220