Title :
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium
Abstract :
The following topics are dealt with: inspection and testing; line pitch interconnect; process modeling; interconnect reliability; CFC elimination and environmental issues; manufacturing operations; statistical methods; multichip module design; manufacturing management and practices; integrated design and manufacturing; high speed interconnect design and analysis; intelligent manufacturing and closed loop control; and low cost multichip modules
Keywords :
circuit reliability; closed loop systems; computer integrated manufacturing; electronics industry; environmental factors; fine-pitch technology; inspection; integrated circuit manufacture; intelligent control; multichip modules; packaging; printed circuit manufacture; printed circuit testing; process control; semiconductor device manufacture; statistical process control; surface contamination; CFC elimination; closed loop control; electronics manufacturing technology; environmental issues; high speed interconnect design; inspection and testing; integrated design and manufacturing; intelligent manufacturing; interconnect reliability; line pitch interconnect; low cost multichip modules; manufacturing management; manufacturing operations; multichip module design; process modeling; statistical methods;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398232
