Title :
GHz AlN lateral overmoded bulk acoustic wave resonators with a f · Q of 1.17 × 1013
Author :
Gong, Songbin ; Kuo, Nai-Kuei ; Piazza, Gianluca
Author_Institution :
Penn Micro & Nano Syst. Lab., Univ. of Pennsylvania, Philadelphia, PA, USA
Abstract :
This work presents a new class of devices, AlN-based lateral overmoded bulk acoustic wave resonators (LO-BAR), to investigate the Q limit imposed by the intrinsic loss of thin film AlN. The LOBAR devices utilize a rectangular AlN thin film plate with a small percentage (0.57%) inter-digitated transducer (IDT) fingers coverage to minimize the piezoelectric-metal interface loss. This design experimentally pushes the f · Q product value (1.17×1013) for thin-film AlN to magnitude level close to the theoretical limit predicted by the Akhizer effect (AKE) for AlN (2.5-5 × 1013). To study the performance of the LOBAR design, the IDT to rectangular plate coverage ratio was varied. The results have shown that the Q of the LOBAR device scales nonlinearly and inversely with coverage ratio. Measurement of the highest Q LOBAR device for temperatures varying between 300 and 400 K have indicated that the AlN LOBAR has a temperature coefficient of frequency (TCF) of -16.25 ppm/K, and phonon-phonon dissipation (AKE) is not yet the dominant loss mechanism.
Keywords :
III-V semiconductors; aluminium compounds; bulk acoustic wave devices; crystal resonators; interdigital transducers; microwave resonators; thin film devices; wide band gap semiconductors; Akhizer effect; AlN; IDT; LOBAR device; Q limit; TCF; interdigitated transducer; intrinsic loss; lateral overmoded bulk acoustic wave resonator; phonon-phonon dissipation; piezoelectric-metal interface loss; rectangular plate coverage ratio; temperature coefficient of frequency; thin film plate; Damping; Micromechanical devices; Performance evaluation; Resonant frequency; Temperature measurement; Transducers; Vibrations;
Conference_Titel :
Frequency Control and the European Frequency and Time Forum (FCS), 2011 Joint Conference of the IEEE International
Conference_Location :
San Fransisco, CA
Print_ISBN :
978-1-61284-111-3
DOI :
10.1109/FCS.2011.5977846