Abstract :
The following topics are dealt with: MEMS/MOEMS; numerical simulation and modelling; reliability and testing; RF MEMS; sensors; compact and behavioral modelling; actuators; CAD; microfabrication, integration and packaging; embossing and mould; large area manufacturing; value and packaging; assembly and packaging; control and read-out architectures for MEMS and NEMS.
Keywords :
CAD; actuators; assembling; embossing; micro-optomechanical devices; microfabrication; moulding; nanoelectromechanical devices; packaging; reliability; sensors; CAD; MOEMS; NEMS; RF MEMS; actuators; assembly; embossing; large area manufacturing; microfabrication; moulding; numerical modelling; numerical simulation; packaging; read-out architectures; reliability; sensors; testing;
Conference_Titel :
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location :
Seville
Print_ISBN :
978-1-4244-6636-8
