DocumentCode
26677
Title
Investigation on dielectric properties of the polyimide- based composite films with high permittivity
Author
Wang, Xiongfei ; Chi, Qing-Guo ; Lei, Qing-Quan ; Gao, Lei ; Yu, Chang-Xing
Author_Institution
Key Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150080, China
Volume
21
Issue
4
fYear
2014
fDate
Aug-14
Firstpage
1471
Lastpage
1477
Abstract
CaCu3Ti4O12 (CCTO) and Zr-doped CaCu3Ti3.95Zr0.05O12 (CCTZO) particles with a giant dielectric permittivity were used as filler to prepare Polyimide (PI)-based composites, respectively. Dielectric properties of CCTO/PI and CCTZO/PI composite films have been investigated comparatively. It is found that the dielectric properties of two kinds of composite films with low concentration filler loading have independence on frequency and temperature, while the dielectric permittivity of two kinds of composite films increases remarkably with increasing concentration of filler loading(>20%) and temperature. The dielectric permittivity of CCTZO/PI composite film with a 40% filler loading reaches up to 70 at 10 Hz, which is higher than that (43) of CCTO/PI composite film with the same concentration filler loading. It is also found that the dielectric permittivity of CCTZO/PI composite film can reach about 260 at 150 ° when the concentration of CCTZO loading is 40 vol%. The conductive properties of two kinds of composite films increase with increasing frequency, temperature and concentration of filler loading. The study indicates that dielectric and conductive properties are closely related to the polarization between filler and PI matrix and semiconductive network supported by the percolation theory.
Keywords
Ceramics; Dielectrics; Films; Loading; Permittivity; Temperature; Temperature dependence; CaCu3Ti3.95Zr0.05O12; Dielectric materials; Polyimide films; percolation theory.; polarization;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2014.004302
Filename
6877972
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