• DocumentCode
    2669646
  • Title

    A two-stage model for negative bias temperature instability

  • Author

    Grasser, T. ; Kaczer, B. ; Goes, W. ; Aichinger, Th ; Hehenberger, Ph ; Nelhiebel, M.

  • Author_Institution
    Christian Doppler Lab. for TCAD, Tech. Univ. Wien, Vienna, Austria
  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    33
  • Lastpage
    44
  • Abstract
    Based on the established properties of the most commonly observed defect in amorphous oxides, the E´ center, we suggest a coupled two-stage model to explain the negative bias temperature instability. We show that a full model that includes the creation of E´ centers from their neutral oxygen vacancy precursors and their ability to be repeatedly charged and discharged prior to total annealing is required to describe the first stage of degradation. In the second stage a positively charged E´ center can trigger the depassivation of Pb centers at the Si/SiO2 interface or KN centers in oxynitrides to create an unpassivated silicon dangling bond. We evaluate the new model to experimental data obtained from three vastly different technologies (thick SiO2, SiON, and HK) and obtain very promising results.
  • Keywords
    MOSFET; annealing; elemental semiconductors; passivation; semiconductor device reliability; semiconductor-insulator boundaries; silicon; silicon compounds; vacancies (crystal); E´ center; KN centers; Si-SiO2; amorphous oxides; annealing; dangling bond; degradation; depassivation; negative bias temperature instability; neutral oxygen vacancy; pMOSFETs; two-stage model; Amorphous materials; Annealing; Degradation; Laboratories; Microelectronics; Negative bias temperature instability; Niobium compounds; Stress; Titanium compounds; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173221
  • Filename
    5173221